Solder pallet material is a heavy-duty glass fiber reinforced plastic which offers extreme strength and excellent electrical, thermal and chemical properties. It is manufactured by using Polyester, Vinyl ester, Epoxy- and modified Epoxy resins combined with glass fibers.

It can keep its mechanical strength, smoothness and original color when continuously used under the temperature of 280 ° C (max. Working temperature below 360 degree 10~20sec). It is easily machining, high intensity and can be easily machining into special mechanical parts.

Application

Solder pallet material is suitable to wave soldering and SMT process. It can achieve the precision required during the SMT machining process, and maintain its flatness in the reflow soldering cycle. The low thermal conductivity of the solder pallet material prevents heat-shrinkage of the bas board, to ensure the quality of reflow process. It is designed and typically recommended for use in manufacturing solder pallets for wave-solder applications of printed circuit boards.

The fixtures made from solder pallet material has the following functions, it can improve the efficiency of the peak soldering process:

Support thin baseboard or soft substrate circuit board

Carry an irregular shape solder pallet.

Use multi-pak panel design to improve production efficiency

Prevent the deformation of the solder pallet during high temperature reflow soldering process

Smoothly surface, good endurance, applicable for Teflon spray painting.

Avoid gold finger contamination by human contact.

Protect bottom side SMT components during the wave soldering process.

Prevent the deformation of the baseboard during the wave soldering process

Standardized the width of the production lines, eliminate the width adjustment of the production line

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